Thin Film Deposition Capabilities

P3P operates customized high-vacuum magnetron sputtering systems designed for precision thin-film and multilayer fabrication. Our deposition infrastructure supports both magnetic and nonmagnetic target materials, from research-scale process development through large-area coating applications.

One of our large sputtering chambers during preparation + nickel plasma from sputtering cathode in the chamber during operation.

Our capabilities include multiple circular and large-area planar magnetron sources, high-power and precision DC sputtering, computer-controlled process gas delivery, programmable substrate translation and rotation, automated target sequencing, and adjustable deposition geometry. These capabilities enable fabrication of complex multilayer structures containing hundreds of nanometer-scale layers, as well as systematic optimization of film thickness, composition, uniformity, and interface quality.

Supporting infrastructure includes turbomolecular and oil-free vacuum pumping systems, helium leak detection, closed-loop cathode cooling, automated process control, and high-vacuum instrumentation. P3P’s systems are configured to support both rapid materials-development experiments and scalable coating processes for advanced materials, neutron optics, nuclear technologies, and other thin-film applications.

(Expanded technical content is currently being prepared alongside
active research programs and will be added soon.)